The design standards of PCB Pad shape and size


The design standards of PCB Pad shape and size 

1. The PCB Standard Packaging Library should be used.

2. All pads should have a minimum of 0.25mm unilateral and a maximum total pad diameter not greater than 3 times the aperture of the part.

3. It is important to ensure that the distance between the two pads is greater than 0.4mm.

In the case of dense wiring, the recommended oval and oval plate. Single-panel pad diameter or minimum width of 1.6mm; weak-sided double-sided circuit board pad diameter hole diameter plus 0.5mm can be too large pad easily lead to unnecessary welding.

4. Pads with a hole diameter of more than 1.2 mm or with a pad diameter of more than 3.0 mm should be designed as diamond or plummet pads

5. For the plug-in components, in order to avoid the phenomenon of copper foil broken when welding, and the single side of the copper foil with a completely coated; and double-sided minimum requirements should make up the tear drop; Figure:

For the plug-in components, in order to avoid the emergence of copper foil broken phenomenon, and the single side of the copper foil is fully coated with the application; and double-sided minimum requirements should make up drops of tears;

6. All machine-on parts must be designed as drip pads along the bending direction to ensure full solder joints on the bent legs.

7. The pads on a large area of copper should be daisy-shaped pads, not Weld. If the PCB has a large area of ground and power line area (over 500 square mm area), the window should be partially open or designed as a grid of FILL (FILL). As shown:

If the PCB has a large area of ground and power line area (over 500 square mm area), the window should be partially open or designed as a grid of FILL (FILL).

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