Printed circuit board 

Various requirements for printed circuit boards make the use of different circuit board substrates necessary. Whereas for many standard applications the classical FR4 material is sufficient, possibly in high Tg version (for improved thermo-mechanical properties), for other areas (such as high frequencies) alternate materials are absolutely required.

The substrate most commonly used in printed circuit boards is a glass fiber reinforced (fiberglass) epoxy resin with a copper foil bonded on to one or both sides. PCBs made from paper reinforced phenolic resin with a bonded copper foil are less expensive and are often used in household electrical devices. The printed circuits are made of copper, which is either plated or etched away on the surface of the substrate to leave the pattern desired. The copper circuits are coated with a layer of tin-lead to prevent oxidation. Contact fingers are plated with tin-lead, then nickel, and finally gold for excellent conductivity. Purchased components include resistors, capacitors, transistors, diodes, integrated circuit chips, and others.

Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue, black, white and red. There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. FR-4 is by far the most common material used today. The board with copper on it is called "copper-clad laminate". Copper foil thickness can be specified in ounces per square foot or micrometres. One ounce per square foot is 1.344 mils or 34 micrometres.

Our circuit boards are used in telecommunications, process control, aerospace, security, traffic signals and lighting, LED, displays, audiovisual equipment, rail transportation, etc. We are also proud to provide high quality PCB used in many stadiums and arenas (giant screens) around the world and in entertainment venues for concerts and international tours by artists and big bands.